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Customer Specific Product Data Sheet VTB4-1000-20M000
CMOS TCXO
Pin Information
Table 1. Pin Function Pin Symbol
1 7 8 14 NC GND Output V DD
Function
No Connect Case Ground CMOS Output waveform Power Supply Voltage (3.3 V 5%)
Performance Characteristics
Table 2. Electrical Performance Parameter
Nominal Output Frequency Supply Voltage
1
Symbol
f0 V DD TOP Tstor IDD V OH V OL IOH IOL
Minimum
3.14 0 -40
Typical
20.000 3.3
Maximum
3.47 +70 +85 20
Units
MHz V C C mA V
Operating Temperature Range Storage Temperature Supply Current Output Voltage Levels (from V DD) High Low Output Current Levels High Low Output Rise/Fall Time
2 3
2.2 0.40
mA -4.0 +4.0 5 40 -4.6 60 +4.6 ns % ppm
tR/tF D deltaf/f O
Output Duty Cycle or Symmetry
Stability over operating temperature/initial tolerance/ 15 years aging/ power supply and load variation Jitter, 10Hz to 20MHz, RMS Jitter, 12kHz to 20MHz, RMS Phase Noise 10 Hz 100 Hz 1kHz 10kHz 100kHz Start Up Time
2 0.5
5 1
pS pS dBc/Hz
-70 -100 -125 -135 -140 Tsu 10 mS
1. A 0.1 F low frequency ceramic bypass capacitor in parallel with a 0.01 F high frequency ceramic capacitor is recommended. 2. Figure 1 defines these parameters. Figure 2 illustrates the operating conditions. 3. Duty cycle is defined as (on time/period) per Figure 1. 4. Measured using a Wavecrest DTS2075 or equivalent. Vectron International *267 Lowell Rd, Hudson, NH 03051 * Tel: 1-88-VECTRON-1* http://www.vectron.com
1/3
VTB4-1000
tR tF
+ ID D 4
V DD
VO H
50%
.1F
. 0 1F
1
2
3
1 5pF
V OL
On Time Period
Figure 1. Output Waveform
Figure 2. Output Test Conditions (255C)
Recommended Reflow Profile:
This oscillator contains a quartz crystal which is susceptible to damage if handled roughly or dropped. Transportation and handling should be carefully performed. ESD precautions should be taken. When stored, units should be kept in conductive containers and only handled at properly grounded workstations by operators using proper ESD procedures. We recommend hand placing and hand soldering units into a PCB. The soldering tip and temperature should be appropriate for 60/40 type solder. Once installed and inspected a non-aqueous board wash is recommended. If cleaning is required then a manual brush cleaning with an appropriate solvent is recommended. Care should be given to prevent mechanical shock to the unit. If not hand placed then we recommend the following solder profile:
Figure 4 IR Reflow Diagram
VTB4-1000
13.7 +/- 0.3 mm
11.5+/-0.3 mm
5.0 mm max
1.73+/-0.2 mm
20.3 +/- 0.3 mm
1.73 +/-0.2 mm
Figure 4. Outline Diagram
Figure 5. Suggested Pad Layout
VTB4-1000
Ordering Information: VTB4-1000-20M000
Table 4. Revision Control
Revision History A B Date 02/03/04 2/10/04 8/13/04 By FBoudreau FBoudreau FBoudreau Description Initial Change stability spec, +/-4.6 ppm min, to -4.6 min and +4.6 max. Delete references to tristate. Correct package drawing dimensions , add suggested pad layout, correct test circuit diagram
USA: Vectron International * 267 Lowell Road, Hudson, NH 03051 * Tel: 1-88-VECTRON-1 * Fax: 1-888-FAX-VECTRON
Vectron International reserves the right to make changes to the product(s) and/or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information.

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